低温镀铁时电流密度对镀层性能的影响  

Effect of current density on performances of deposit in low-temperature iron plating process

作　　者：刘忆[1] 杨森[2] 殷锦捷[2] 韩辉[2] 

机构地区：[1]徐州工程学院机电分院,江苏徐州221008 [2]辽宁工程技术大学材料系,辽宁阜新123000

出　　处：《电镀与涂饰》2008年第2期15-16,共2页Electroplating & Finishing

摘　　要：研究了不同电流密度下所得低温镀铁层的沉积速率、显微硬度和腐蚀速率。结果表明,当电流密度为14A/dm2时镀层可获得最佳的综合性能。电流密度过低时,镀层沉积速率慢,硬度低;电流密度过高时,镀层表面出现针孔,厚度不均。The deposition rate, microhardness and corrosion rate of Fe coating prepared by low-temperature plating at different current densities were studied. The results showed that the Fe deposit obtained at 14 A/dm^2 has optimal comprehensive performance, The Fe deposit prepared at too low current density has low deposition rate and microhardness, and that prepared at too high current density has pinholes on the surface with non-uniform thickness.

关 键 词：镀铁工艺 低温 电流密度 沉积速率 显微硬度 耐蚀性 

分 类 号：TQ153.19[化学工程—电化学工业]