弹性约束自由磨料研抛加工的材料去除机理  

Material Removal Mechanism for Free Abrasive Polishing with Flexible Restraint

作　　者：张富[1] 赵继[2] 

机构地区：[1]吉林大学机械科学与工程学院 [2]吉林大学

出　　处：《农业机械学报》2008年第2期147-150,共4页Transactions of the Chinese Society for Agricultural Machinery

基　　金：国家自然科学基金资助项目(项目编号:50175049)

摘　　要：弹性约束自由磨料研抛加工是悬浮液中的磨粒在工具的弹性约束下实现对工件表面的加工方法。建立了反映加工过程影响因素的球形工具加工区域模型,以及类球形和棱锥体磨粒的力学模型,讨论了材料去除机理,分析了加工自由曲面的可行性。利用Al2O3和SiC两种磨料对光学玻璃进行了加工试验,结果表明弹性约束自由磨料加工方法应用于超精密加工是有效的,并验证了对磨粒尺度影响规律的分析。The technique of free abrasive polishing with elastic restraint was proposed, and the work piece surface was polished by abrasive in suspending liquid with polishing tool as flexible restraint. The spherical tool machining area model reflecting the process influence factors, and the mechanical model of sphere and pyramid particles completely were established. The material removal mechanism was discussed and the feasibility of polishing free surface was analyzed subsequently. The experiments of polishing the optical glass use of two kinds of abrasive Al2O3 and SiC were carried out respectively. The validity of machining the ultra precise surface with flexible restraint abrasive was indicated, and the influence regulation of abrasive dimension was proved by the experimental results.

关 键 词：弹性约束 研抛加工 去除机理 磨粒模型 

分 类 号：TG580.68[金属学及工艺—金属切削加工及机床]