铜导线短路熔痕微观形貌特征分析与研究  

Microstructure Study on Primary and Secondary Molten Marks of Copper Wires by SEM

作　　者：王芸[1] 安晓利[1] 魏星[1] 李端杰 

机构地区：[1]中国人民武装警察部队学院,廊坊065000 [2]陕西省延安消防支队

出　　处：《火灾科学》2008年第1期44-48,共5页Fire Safety Science

摘　　要：采用模拟实验的方法制备了铜导线一次短路熔痕和二次短路熔痕,利用KYKY-2800B型扫描电子显微镜(SEM)对铜导线一次短路熔痕和二次短路熔痕的微观形貌进行了观察,并对内部气孔的数量、大小、分布等进行了统计分析,发现了一次短路气孔的数量、分布与二次短路之间的差别与长期采用的鉴定依据不同。According to copper conducting wires＇ melting marks forming rules, the samples were prepared by simulating actual fire scenes and the micro characteristics were observed by SEM. And that the pore size distribution were quantitatively studied by use of statistic analysis methods. The results show that the distinctness of pore＇s quantities, pore size and spatial distribution between primary and secondary molten marks of copper wires are not same as the formerly cheekup gist.

关 键 词：短路熔痕 扫描电子显微镜 微观形貌 气孔 

分 类 号：O766.1[理学—晶体学]