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机构地区:[1]西安理工大学自动化学院电子工程系,西安710048
出 处:《Journal of Semiconductors》2008年第2期338-343,共6页半导体学报(英文版)
基 金:西安市应用材料创新基金资助项目(批准号:XA-AM-200514)~~
摘 要:提出了一种全新的器件结构——双栅双应变沟道全耗尽SOIMOSFETs,模拟了沟道长度为25nm时器件的电学特性.工作在单栅模式下,应变沟道(Ge=0.3)驱动能力与体Si沟道相比,nMOS提高了43%,pMOS提高了67%;工作在双栅模式下,应变沟道(Ge=0.3)与体Si沟道相比较,驱动电流的提高nMOS为31%,pMOS为60%.仿真结果表明,双栅模式比单栅模式有更为陡直的亚阈值斜率,更高的跨导以及更强的抑制短沟道效应的能力.综合国内外相关报道,该结构可以在现今工艺条件下实现.A novel fully-depleted SOl device structure with a double-gate and dual-strained channel is presented. The electrical characteristics of this device with the effective gate length scaled down to 25nm are simulated. When the Ge content reaches 30%,by the adoption of a single-gate (SG) control mechanism,the drive currents are improved by 43 % and 67%, respectively, for the strained-Si n-MOSFET and the strained-SiGe p-MOSFET over their unstrained counterparts. By adopting double-gate (DG) control mechanisms, the similar enhancements are 31% and 60%,respectively. The simulation results show that the DG MOSFETs exhibit a steeper subthreshold slop,a higher transconductance,and a stronger capacity to restrict short-channel-effects over SG MOSFETs. The new structure can be achieved with today's semiconductor manufacturing level.
分 类 号:TN386[电子电信—物理电子学]
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