Cu-32Mn-8Ti预合金粉末与金刚石颗粒的界面反应  

Interfacial Reaction between Diamond Grit and Cu-32Mn-8Ti Prealloyed Powder

作　　者：赵宁[1] 袁洁[1] 南俊马[1] 徐可为[1] 

机构地区：[1]西安交通大学金属材料强度国家重点实验室,西安710049

出　　处：《人工晶体学报》2008年第1期124-128,共5页Journal of Synthetic Crystals

基　　金：陕西省工业攻关项目(2005K06-G8)

摘　　要：采用自制Cu-32Mn-8Ti预合金粉末为粘合剂,在低真空钎焊条件下制备了金刚石复合材料。利用扫描电镜、能谱仪、X射线衍射仪等研究预合金粉末与金刚石颗粒界面反应。结果表明,在试验条件下,胎体中的Ti原子向金刚石表面扩散,形成约为3～5μm的扩散层,并与金刚石颗粒表面的C发生化学反应生成TiC,呈非连续层片状分布于金刚石颗粒表面,实现了金刚石颗粒与金属的化学键结合。A diamond composite material using a new Cu-32Mn-8Ti preaUoyed powder as the adhesion matrix is fabricated in a low vacuum brazing environment. Interfacial reaction between diamond grit and Cu-32Mn-8Ti prealloyed powder is studied by using SEM, EDS, XRD. The results show that Ti in the preaUoyed powder can diffuse towards the diamond interface and induces a 3-5μm diffusing layer formed near the diamond interface. Ti can react with C to produce a discrete lamina-shaped TiC layer on the surface of diamond grit. The formation of TiC on the surface of diamond grit induces chemical bond between metal matrix and diamond.

关 键 词：Cu-32Mn-8Ti预合金粉末 金刚石颗粒 界面反应 低真空钎焊 

分 类 号：TG454[金属学及工艺—焊接]