大功率LED封装有限元热分析  

Thermal Analysis of Finite Element for High-Power LED Packaging

作　　者：田大垒[1] 关荣锋[1] 王杏[1] 

机构地区：[1]河南理工大学材料科学与工程学院,河南焦作454003

出　　处：《半导体技术》2008年第3期248-251,共4页Semiconductor Technology

基　　金：河南省重点科技攻关资助项目(072102240027);河南理工大学博士基金资助项目(648602);河南理工大学研究生学位论文创新基金资助项目(644005)

摘　　要：介绍了有限元软件在大功率LED封装热分析中的应用,对一种多层陶瓷金属(MLCMP)封装结构的LED进行了热模拟分析,比较了不同热沉材料的散热性能,模拟了输入功率以及强制空气冷却条件对芯片温度的影响。结果表明当达到热稳态平衡时,芯片上的温度最高,透镜顶部表面的温度最低,当输入功率达到3 W时,芯片温度超过了150℃,强制空冷能显著改善器件的散热性能。Finite element software applied for thermal analysis of LED packaging was presented, a LED packaging structure based on LTCC was simulated, heat dissipation of different heat-sink materials were compared, and the influences of power input and forced air-cooling conditions on the temperature of the chip were simulated. The results show that the highest temperature point is on the chip and the lowest temperature point is on the top surface of the lens when at thermal equilibrium, the temperature of the chip exceeds 150℃ when the power input is 3 W, the heat dissipation performance is improved notably on forced air-cooling conditions.

关 键 词：大功率发光二极管 有限元 热分析 多层陶瓷金属封装 

分 类 号：TN312.8[电子电信—物理电子学] TN305.94