低温等离子体技术及其在塑料包装中的应用  

Low Temperature Plasma Technology and Its Application in Plastic Packaging

作　　者：周浩[1] 柯贤文[1] 程红炬[1] 

机构地区：[1]武汉大学,武汉430079

出　　处：《包装工程》2008年第3期53-55,共3页Packaging Engineering

摘　　要：介绍了低温等离子体技术及其特点,论述了低温等离子体技术在改善塑料薄膜印刷适性、提高粘接性及增强PET瓶阻隔性等塑料包装中的应用。Low temperature plasma technology and its characteristics were introduced. The application of the low temperature plasma technology in improving the printability, increasing the adhesion of plastic film, and enhancing the barrier properties of the PET bottles were discussed.

关 键 词：低温等离子体 阻隔性 粘接性 印刷适性 

分 类 号：TB484[一般工业技术—包装工程] TB487