小麦麸质模压板的性能研究  

Properties of Hot Press Moulded Wheat Gluten Plate

作　　者：杨宁[1] 陆吴斌[1] 袁荞龙[1] 叶邦策[2] 祝磊 

机构地区：[1]超细材料制备与应用教育部重点实验室,华东理工大学材料科学与工程学院,上海200237 [2]华东理工大学生物工程学院,上海200237 [3]Institute of Materials Science,University of Connecticut,Storrs,CT06269

出　　处：《绝缘材料》2008年第1期3-7,共5页Insulating Materials

基　　金：上海市科委-联合利华研究与发展基金资助项目(2005008)

摘　　要：研究了小麦麸质(Wheat Gluten,WG)在不同的模压温度、压力及不同的模压时间下模压成型样品的力学性能和耐水性,根据模压工艺对小麦麸质热压材料的力学性能和耐水性的影响,得到了小麦麸质理想的模压成型工艺条件为140℃下6.5 MPa,5 min+10.0 MPa,15 min。小麦麸质热压材料的拉伸强度为64 MPa,弯曲强度为82 MPa。对小麦麸质模压板的电性能研究表明,干态下其介电性能随电场频率增加而下降,但变化小;湿态下其介电性能明显提高,且随频率增加迅速下降,超过104Hz后区域变化趋于稳定;热压小麦麸质材料的电阻率随频率的增加呈直线下降;小麦麸质热压材料的电性能主要决定于材料结构的密实程度。The mechanical and water-resistant properties of the hot press moulded wheat gluten under various moulding temperature, pressure and time were studied. The research on the effects of moulding process on the mechanical properties of the wheat gluten material found that the optimal hot press moulding process is as follows： 140℃/6.5 MPa for 5 minutes and 10.0 MPa for 15 minutes. The tensile strength of the moulded wheat gluten is 64 MPa, the bending strength 82 MPa. The study on the electrical property shows that its dielectric property decreases with the slowly increase of frequency in dry state; in hygrometric state （52.9%）, the dielectric property grows obviously and declines swiftly with the increase of frequency; and it tends to be stable when the frequency is over 104 Hz. The specific resistance decreases linearly with the increase of the frequency. The results indicate that the electric properties of the hot press moulded wheat gluten are subject to the compaction rate of the material structure.

关 键 词：小麦麸质 热压成型 力学性能 介电性能 电阻率 

分 类 号：TM201.43[一般工业技术—材料科学与工程] TM215[电气工程—电工理论与新技术]