AZ系镁合金化学镀镍的初始沉积机理研究  

Study on the Initial Deposition Mechanism of Electroless Nickel Plating on AZ Magnesium Alloy System

作　　者：任晨星[1] 曹文博[1] 关绍康[1] 王剑锋[1] 彭丽[1] 

机构地区：[1]郑州大学材料科学与工程学院,河南郑州450002

出　　处：《铸造技术》2008年第3期380-382,共3页Foundry Technology

基　　金：国家自然科学基金(No.50571092)

摘　　要：采用金相观察、XRD、SEM、EDS等实验方法,研究了铸态和固溶态AZ系镁合金化学镀Ni-P合金的初始沉积特点。结果表明,镀层初始沉积最先是电化学机制占主导地位,然后是次磷酸盐的还原作用机制和电化学机制并存,最后逐步过渡到以次磷酸盐的还原作用机制占主导地位。同时基体成分和组织影响着镀层的初始沉积机制和沉积速度。The characteristics of initial deposition of electroless plating Ni-P alloy on the as-cast and solution-treated AZ magnesium alloy system were studied by optical microscopy, XRD. SEM and EDS. The results show that the electrochemical deposition plays a dominant role in the early stage of initial deposition coating, then reduction reaction and the electrochemical mechanism of hypophosphite coexist, finally reduction reaction of hypophosphite gradually play a dominant role. Meanwhile, the substrate composition and microstructure affect the initial deposition mechanism and depositing rate.

关 键 词：化学镀 初始沉积机理 AZ系镁合金 Ni—P合金镀层 

分 类 号：TQ153.12[化学工程—电化学工业]