大功率半导体激光器模块散热结构的数值优化  

Numericial Optimization of Heat Dissipation of High Power Diode Laser Module

作　　者：尧舜[1] 丁鹏[1] 张亮[1] 张辉[1] 曹银花[1] 王智勇[1] 

机构地区：[1]北京工业大学激光工程研究院国家产学研激光技术中心,北京100022

出　　处：《半导体光电》2008年第1期49-51,共3页Semiconductor Optoelectronics

摘　　要：考虑大功率半导体激光bar外延结构中GaAs衬底热阻导致p、n面散热的非对称性,利用商用有限元软件Ansys对目前常用的DPSSL侧泵浦源亚封装子模块的散热性能进行了分析和结构优化,并根据优化结构实际制备出3 bar激光线阵泵浦源,其连续输出功率超过120 W,中心波长为807.7 nm,光谱宽度(FWHM)为2.8 nm。该数值分析结果对根据实际需要设计、封装出不同结构尺寸的大功率半导体激光泵浦源模块具有现实的指导意义。A two-dimensional analysis procedure for the thermal performance of high power diode laser array module has been developed with considering the difference of thermal resistance between p side and n side of the package and applied to optimize the module design. The thermal resistance of the module is also investigated by changing the size of the heat spreader. A 3 bar laser diode arrays pump source whose output power is over CW 120 W and the central wavelength is 807. 7 nm with a FWHM of 2. 8 nm by following the results of optimization ensures the numerical procedure.

关 键 词：大功率半导体激光器 泵浦源 温度分布 结构优化 

分 类 号：TN365[电子电信—物理电子学]