聚合工艺对聚噻吩固体片式铝电解电容器的影响  

Influence of polymerization conditions on the performance of solid-chip aluminum capacitor using PEDT as conducing electrolyte

作　　者：吴耿云 程贤甦[2] 林俊鸿[1] 

机构地区：[1]福建国光新型电子元件与材料技术研究院,福建福州350015 [2]福州大学材料科学与工程学院

出　　处：《功能材料》2008年第3期414-416,共3页Journal of Functional Materials

基　　金：国家科技型中小企业技术创新基金资助项目(05C26113500892)

摘　　要：采用导电高分子材料聚(3,4-乙撑二氧噻吩)(PEDT)制备固体片式铝电解电容器,主要探索了化学聚合工艺对聚噻吩固体片式铝电解电容器性能的影响。结果表明,低的聚合溶液浓度可以提高所制备电容器的容量、降低损耗和等效串联电阻(ESR),但需要增加聚合次数以获得所需厚度的PEDT膜;化学聚合过程中烘干温度为40℃并进行适当次数的清洗,其所制备的产品容量较高,损耗较小,ESR低;增加聚噻吩的化学聚合次数可以提高电容器的容量引出水平,并降低损耗和ESR。Poly（3,4-ethylenedioxythiophene） （PEDOT） were synthesized by chemical oxidative polymerization and formed a conducting polymer electrolyte in solid-chip aluminum capacitors. The influence of chemical polymerization conditions on the capacitors was investigated. The results showed that lower concentration of mono- mer and oxidizing agent,drying at 40℃ and washing certain times,increasing times of dipping could improve the performance of derived solid chips aluminum capacitors with higher capacitance and lower equivalent series resistance （ESR）.

关 键 词：化学氧化聚合 聚(3 4-乙撑二氧噻吩) 固体片式铝电解电容器 

分 类 号：TN605[电子电信—电路与系统] TM535[电气工程—电器]