铜板带水平连铸电磁搅拌中熔体的流动和凝固  

Flow and Solidification of Copper Thin-slab in Horizontal Continuous Casting with Electromagnetic Stirring

作　　者：于湛[1] 李伟轩[1] 邓康[1] 雷作胜[1] 任忠鸣[1] 

机构地区：[1]上海大学现代冶金与材料制备重点实验室

出　　处：《特种铸造及有色合金》2008年第3期229-231,共3页Special Casting & Nonferrous Alloys

基　　金：国家高技术研究发展计划(863计划)资助项目(2002AA3Z1410)

摘　　要：用水银模拟了磁场和直流电场作用下板带水平连铸结晶器内的流动,测量了沿拉坯方向上的流速,分析了流动对凝固过程的影响,并在模拟的基础上进行了铜合金板带水平连铸工业试验。结果表明,电磁搅拌使铸坯气孔减少或消失,平均偏析率下降,柱状晶组织细化并出现中心层等轴晶带,当电流增大到400A以上时,气孔完全消失,解决了铜板带坯柱状晶对接问题。The effects of melt flow on the solidification behavior were investigated by measuring the flow velocity along pulling-direction based on the flow simulation of mercury in mold of horizontal continuous casting thin-slab with electromagnetic stirring.The horizontal continuous casting copper thin-slab was produced on the basis of the mentioned results.The results reveal that electromagnetic stirring can reduce and eliminate the gas hole in the copper thin-slab and decrease the average segregation degree with the refinement of columnar grain and the existence of equiaxed grain region in center of the thin-slab,realizing the columnar-equiaxed grain transition in the horizontal continuous casting copper thin-slab.

关 键 词：板带坯 水平连铸 电磁搅拌 流动 凝固 

分 类 号：TG291[金属学及工艺—铸造]