无铅无镉化学镀镍复合添加剂的研究  

Study on lead-and cadmium-free composite additive for electroless nickel plating

作　　者：刘海萍[1,2] 李宁[1,2] 毕四富[3] 张冬[3] 

机构地区：[1]哈尔滨工业大学应用化学系 [2]哈尔滨工业大学(威海)海洋学院,山东威海264209 [3]哈尔滨工业大学(威海)海洋学院

出　　处：《电镀与涂饰》2008年第3期19-21,24,共4页Electroplating & Finishing

摘　　要：在前期确定的基本化学镀镍配方的基础上,通过正交试验优选出一组无铅无镉复合添加剂:20mg/L硫酸铜、3mg/L硝酸银、4mg/L碘酸钾、10mg/L硫酸铈和4mg/L唑类添加剂M。研究了该无铅无镉复合添加剂对化学镀镍液的稳定性、镀速、镀层孔隙率及外观的影响。结果表明,该添加剂使镀液的稳定性由23s升高至10h,v=15μm/h,孔隙率=0,w(镀层中磷)=10.1%;所得镀层外观光亮、细致。与某公司商品含铅镉添加剂相比,该复合添加剂对镀液、镀层性能的改善作用更为优异。Based on previous bath formulation for electroless nickel plating, a lead-and cadmium-free composite additive containing 20 mg/L CuSO4.5H20, 3 mg/L AgNO3, 4 mg/L KIO3, 10 mg/L Ce2（SO4）3 and 4 mg/L triazole derivative M, were selected by orthogonal test. The effects of the lead-free and cadmium-free additive on the bath stability, electroplating speed, porosity and appearance of the nickel deposit were investigated. It was found that the bath stability determined using Pd stability test was significantly increased from 23 s in the absence of the additive to 10 h in the presence of the additive, v = 15 μm/h, porosity = 0, w（P） = 10.1%, and a bright and dense appearance was gained. The developed additive was much superior to a commercialized lead and cadmium containing additive in terms of increasing the bath stability and the performance of the nickel deposit.

关 键 词：化学镀镍 无铅无镉 复合添加剂 正交试验 

分 类 号：TQ153.15[化学工程—电化学工业]