碳钢/Cu/碳钢系统轧制——扩散复合等温凝固过程的动力学模拟计算  

Dynamic simulation of isothermal solidification in steel/Cu/steel system rolling-diffusion bonding process

作　　者：李红[1] 栗卓新[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100022

出　　处：《焊接学报》2008年第3期61-64,共4页Transactions of The China Welding Institution

基　　金：北京市属市管高等学校人才强教计划项目

摘　　要：采用厚度为50μm的纯铜箔作为中间层,在1100℃下对低碳钢板进行了轧制—扩散复合,考察了塑性变形对界面结合强度和中间层厚度的影响。基于试验结果,系统地研究了碳钢/Cu/碳钢系统轧制——扩散复合中间层等温凝固过程的动力学,并建立了等温凝固时间模型。结果表明,一定的塑性变形可以有效缩短中间层液相全部完成等温凝固的时间。试验测量的等温凝固中间层厚度随时间的变化曲线与理论计算曲线衔接与吻合良好,中间层变化和液相区等温凝固过程互相协调,有助于提高界面结合强度。采用晶内扩散和晶界扩散共同作用下的有效扩散系数,可以精确预测中间层等温凝固时间。Rolling-diffusion bonding experiments were performed on steel/Cu/steel system using 50 μm thick copper as interlayer. The effect of plastic deformation on bonding strength and interlayer thickness was investigated. Based on experiments, the kinetics of isothermal solidification was systematically studied. And a numerical model of isothermal solidification time was developed. The results show that the isothermal solidification time is obviously reduced due to the effect of plastic deformation. A reasonable isothermal solidification time was obtained when an effective diffusion coefficient was used, indicating the intercrystalline and grain boundary diffusion of Cu in steel play an important role. The evolution of interlayer thickness indicates a good agreement between the calculation results and experimental measurement.

关 键 词：轧制-扩散连接 塑性变形 等温凝固 动力学模拟 有效扩散系数 

分 类 号：TG335.8[金属学及工艺—金属压力加工]