酚醛树脂/木粉复合体系的固化动力学  

Curing Behaviors for Phenolic Resin/Wood Flour System

作　　者：季庆娟[1] 刘胜平[1] 刘敏[1] 马源[1] 赵春秋[1] 

机构地区：[1]华东理工大学材料科学与工程学院,上海201512

出　　处：《高分子材料科学与工程》2008年第3期41-43,共3页Polymer Materials Science & Engineering

摘　　要：采用非等温DSC技术研究了不同升温速率下热固性酚醛树脂/木粉复合体系的固化行为。用Kissinger法进行DSC数据处理,获得了其固化反应动力学参数,并建立了酚醛树脂/木粉复合体系的固化动力学模型。结果表明:木粉的加入加速了酚醛树脂固化反应,同时也降低了酚醛树脂固化反应活化能。酚醛树脂/木粉复合体系固化动力学模型为合理研究该体系固化工艺参数提供了依据。Differential scanning calorimetry （DSC） was used to study the thermal behavior of phenolic resin/wood flour system by dynamic method. Curing reaction kinetic parameters was obtained by data processed by means of Kissinger method and set up a model for phenolic resin/wood flour system. DSC analysis shows that the addition of wood to the resin moves two separated peaks in the DSC curves. It also accelerates the addition reaction in the curing process of phenolic resin and reduced the activation energies for phenolic resin. The model is important for determining the curing parameters.

关 键 词：酚醛树脂 木粉 固化行为 差热分析 

分 类 号：TQ323.1[化学工程—合成树脂塑料工业]