气体渗硼孔洞的产生机制及防止方法  

THE FORMING MECHANISM OF THE GASEOUS BORONIZING LAYER VOIDS AND THE PREVENTION OF THE FORMATION OF THE VOIDS

作　　者：李辉[1] 

机构地区：[1]武汉食品工业学院机电工程系

出　　处：《武汉食品工业学院学报》1997年第2期39-44,共6页

摘　　要：通过对渗层孔洞的电子探针扫描和气体渗硼的热力学分析证实；孔洞主要是由ＦｅＣｌ产物组成，气氛中的残留Ｈ２Ｏ、Ｏ２加剧了产物的形成。严格控制气氛中残留Ｈ２Ｏ、Ｏ２含量，不仅可有效地防止孔洞的形成，而且可大幅度降低ＢＣｌ３用量。讨论了Ｂ、Ｃｌ２的扩散特点及温度对孔洞形成的影响。Through microscope probe scanning and thermodynamies analysis ,the author proves that in the boronizing atmosphere of BCl 3+H 2,the layer void is mainly composed of the products of iron chloride and the retained H 2O and O 2 in the BCl 3 +H 2 atmosphere accelerates the formation of the voids. The strict control of the retained content of H 2O and O 2 in the atmosphere can not only efficiently prevent the formation of voids ,but also greatly reduce the dosage of BCl 3 .In addition, the author discusses the diffusion characteristic of B and Cl atoms and the effect that the baronizing temperature has on the formation of the layer voids.

关 键 词：气体渗硼 孔洞 防止方法 机械零件 热处理 

分 类 号：TG156.87[金属学及工艺—热处理]