新型电子封装用金刚石/金属复合材料的组织性能与应用  

Properties and Application of Diamond/Metal Composites for Electronic Packaging

作　　者：方针正[1] 林晨光[1] 张小勇[1] 崔舜[1] 楚建新[1] 

机构地区：[1]北京有色金属研究总院,北京100088

出　　处：《材料导报》2008年第3期36-39,43,共5页Materials Reports

摘　　要：随着微电子技术的高速发展,金刚石/金属复合材料作为新一代的电子封装材料受到了广泛的重视,它与传统的电子封装材料相比,具有更优异的性能,是未来封装、热沉材料最有潜力的发展方向之一。对金刚石/金属复合材料的性能、制备工艺及应用发展进行了综述,并提出了未来的研究开发方向。With the rapid development of microelectronic technology, diamond/metal composites as a new generation electronic packaging material have received more and more attention. Diamond/metal composites have more outstanding performance than the traditional electronic packaging materials. They have the most development potential to be the new gen- eration electronic packaging, heat sink materials. This paper overviews the properties, manufacturing process and applications of diamond/metal composites, and points out the problems to be resolved in the future.

关 键 词：金刚石/金属 复合材料 电子封装 热导率 

分 类 号：TB331[一般工业技术—材料科学与工程] TN305.94[电子电信—物理电子学]