Sn／Cu接头界面金属间化合物层的生长及强磁场的影响  

Growth of interfacial intermetallic compound layers in Sn/Cu joints during aging and effect of high magnetic field

作　　者：程从前[1,2] 赵杰[1,2] 徐洋[1,2] 许富民[1,2] 杨朋[1,2] 

机构地区：[1]大连理工大学三束材料改性国家重点实验室,大连116024 [2]大连理工大学材料科学与工程学院,大连116024

出　　处：《中国有色金属学报》2008年第3期449-456,共8页The Chinese Journal of Nonferrous Metals

基　　金：国家自然科学基金资助项目(50471068);“十一五”国家科技支撑计划资助项目(2006BAE03B02-2);国家自然科学基金广东省联合基金重点资助项目(V0734008)

摘　　要：钎焊和扩散焊制备的Sn/Cu接头在无磁场下不同温度时效,研究接头界面处金属间化合物(IMC)层的生长行为。结果表明:两种接头界面IMC层在时效初始时刻的横截面和形貌均不同,在时效过程中的生长行为类似,钎焊和扩散焊接头界面IMC层的生长激活能分别为116和94kJ/mol。为研究强磁场对界面IMC层生长行为的影响,两种试样在190℃、磁场强度为8T时效。实验结果表明:两种接头界面IMC层的生长动力学相同,但晶粒形貌和晶体取向差别明显。The growth behaviors of interfacial intermetallic compound （IMC） layers in soldered and diffusion bonding Sn/Cu joints during aging and the effect of high magnetic field were investigated. The results show that the cross sections and morphologies of IMC layers in soldered and diffusion-bonding joints before aging are different. The growth behaviors of these two IMC layers are similar when these joints are aged without magnetic field. The growth activation energies for the two IMC layers are 116 and 94 kJ/mol, respectively. In order to study the effect of high magnetic field on the growth behavior of IMC layers, the samples were aged at 190℃ in 8 T of high magnetic field strength. The results show that there exit unobvious difference between the growth kinetics of IMC layers in the two joints. However, the morphologies and orientations of IMC layers in these two joints change by high magnetic field.

关 键 词：Sn/Cu 金属间化合物层 时效 强磁场 

分 类 号：TG425.1[金属学及工艺—焊接]