工艺条件对Ni颗粒增强无铅复合钎料IMC组织形态的影响  

Effects of Process Condition on Morphologies of Intermetallic Compounds in Ni Particle Reinforced Lead-free Composite Solder

作　　者：聂京凯[1] 郭福[1] 夏志东[1] 雷永平[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100022

出　　处：《新技术新工艺》2008年第3期95-100,共6页New Technology & New Process

基　　金：北京市科技新星计划(2004B03);教育部新世纪优秀人才支持计划资助项目

摘　　要：在钎料中加入增强颗粒是一个有效的提高钎焊接头的途径。早期对Ni颗粒增强的Sn-3.5Ag基复合钎料的研究表明,在Ni颗粒周围存在着不同形态的金属间化合物层,包括"向日葵状"的金属间化合物和"多边形状"的金属间化合物。无论是向日葵状的金属间化合物还是多边形状的金属间化合物,他们的形态形成由加工工艺所决定。而在钎焊过程中的热输入起了决定性的作用。而热输入的控制为再流过程中不同的加热速率、不同的冷却速率以及焊接峰值保温等不同的热输入条件都影响着IMC的形态的发展。Particle-reinforcement addition to solders provides an effective way of improving the comprehensive properties of solder joints.Earlier studies on Ni particle reinforced Sn-3.5Ag based composite solder are revealed that the morphology of intermetallic compound(IMC) layers around Ni reinforcement particles exhibited either 'sunflower' or 'blocky faceted' shapes depending on different processing conditions.The amount of thermal input is found to play a significant role in the formation of the different morphology of the IMC.In the current research,the relationship between the morphology of IMCs around Ni particles and the amount of thermal input applied to Ni particle-reinforced composite solder joint is investigated.Different thermal input is provided by variation of heating and cooling rates during the fabrication of solder joints.All the experiments are carried out to generate equivalent amount thermal input that cause desired IMC morphology.

关 键 词：增强复合钎料 金属间化合物 Ni颗粒 

分 类 号：TG425[金属学及工艺—焊接]