Ti基化学镀Ni-P和Ni-P-Cg镀层晶化动力学  

Crystallization Kinetics of Electroless Ni-P and Ni-P-Cg Composite Coating on Titanium

作　　者：范洪富[1] 闫红娟[2] 张翼[2] 刘振雷 梁桂芳[2] 

机构地区：[1]大庆石油学院石油工程学院,大庆163318 [2]大庆石油学院化学化工学院,大庆163318 [3]中国石油吉林化工高碳醇厂,吉林132000

出　　处：《无机化学学报》2008年第3期403-408,共6页Chinese Journal of Inorganic Chemistry

基　　金：国家自然科学基金(No.50574017)资助项目

摘　　要：利用化学镀技术在Ti基体材料表面制备了Ni-P合金镀层和Ni-P-Cg复合镀层。利用SEM、XRD和EDS等分析了镀层的晶化过程,用差热分析仪研究了Ni-P合金镀层和复合镀层的晶化动力学,运用Ozawa、Freeman-Carroll、Achar和Coats-Redfern方法对非等温动力学数据进行了分析和比较。结果发现,复合镀层的特征温度Tm和晶化激活能E均高于Ni-P合金镀层,而热焓值|ΔH|却低于Ni-P镀层;计算出Ni-P合金镀层和Ni-P-Cg复合镀层晶化激活能分别为308.9kJ·mol^-1和412.99kJ·mol^-1、指前因子A分别为58.03s^-1和77.84s^-1,确定了Ni-P合金镀层和复合镀层晶化动力学方程。Ni-P alloy coatings and Ni-P-Cg composite coatings on titanium surface were obtained by electroless plating method. The crystallization processes of coatings were analyzed by SEM, XRD and EDS. The crystallization kinetics of coatings was studied by differential thermal analysis. The data of non-isothermal kinetics were analyzed and compared by methods of Ozawa, Freeman-Carroll, Achar and Coats-Redfern. The results indicate that characteristic temperature Tm and crystallization activation energy E of Ni-P-Cg coating are higher than Ni-P coatings, while the enthalpy value is lower. The kinetic equations were determined, giving crystallization activation energies of Ni-P coating and Ni-P-Cg coating of 308.90 kJ·mol^-1 and 412.99 kJ·mol^-1, respectively, and pre-exponential factors A of 58.03 s^-1 and 77.84 s^-1, respectively.

关 键 词：钛 化学镀 晶化 动力学 

分 类 号：O614.411[理学—无机化学] O614.813[理学—化学]