电力电子集成模块中压接结构及其电接触特性  

Pressure Contact Structure and Electrical Contact Propoerty of Integrated Power Electronic Module

作　　者：何晓宇[1] 曾翔君[1] 杨旭[1] 王兆安[1] 

机构地区：[1]西安交通大学电气工程学院,陕西省西安市710049

出　　处：《中国电机工程学报》2008年第9期50-54,共5页Proceedings of the CSEE

基　　金：国家自然科学基金项目(50237030)~~

摘　　要：提出了一种在电力电子集成模块内使用的簧片压接互连工艺,该工艺具有很高的长期可靠性,核心是使用铍青铜制作的弹簧,该弹簧不仅提供足够的压接力,同时还实现可靠的电气连接。压接工艺具有十分优良的抵抗热应力的能力,并且工艺流程也很简单。研究了压接工艺的电接触特性。基于该工艺研制了一个4kW的半桥集成模块,并通过温度循环实验和功率考核实验证明了工艺的可行性。This paper presents a novel pressure contact interconnect technique in integrated power electronic module （IPEM） with high reliability. The central component of this technique is a break spring made of BeCu alloy. The break spring not only provides enough press-contact force, but also implements electrical interconnection. The technique exhibits excellent ability of withstanding thermal stress, and is also manufactured with a very simple process. Contact resistance of the pressure contact structure is investigated. A half-bridge IPEM based on pressure contact technique is proposed. Thermal cycling and power experiments were carried out, and the break spring pressure contact technique is verified to be feasible.

关 键 词：电力电子集成模块 压接互连方式 铍青铜 电接触 

分 类 号：TN305[电子电信—物理电子学]