铜电结晶的研究进展  

Progress of Copper Electrocrystallization

作　　者：李强[1] 辜敏[1] 鲜晓红[2] 

机构地区：[1]重庆大学西南资源开发及环境灾害控制工程教育部重点实验室,重庆400044 [2]重庆大学化学化工学院,重庆400044

出　　处：《化学进展》2008年第4期483-490,共8页Progress in Chemistry

基　　金：高等学校重点实验室访问学者基金项目(2005);重庆市科委自然科学基金计划(CSTC,2006BB6144)资助

摘　　要：铜具有的优良导电性和机械加工性能以及其电沉积工艺的诸多优点,决定了铜电沉积在各行业特别是近年在高新技术中的广泛应用。铜的电结晶过程是铜电沉积的初期阶段,它决定了后续的电沉积过程及最终镀层的结构和性能,因此一直是研究的热点。本文综述了铜电结晶的研究方法、电结晶理论研究的进展,详细讨论了pH值、添加剂、金属离子、基体以及电沉积条件等因素对铜电结晶的机理和成核动力学的影响,并对研究中存在的问题提出了展望。Copper electrodeposition has been widely applied in various industries because it has many advantages over other technologies and copper deposits has good conductivity and mechanical capability. Copper electrocrystallization process is the initial stage of copper electrodeposition. Copper electrocrystallization has always been attracted intensively because it determines not only the latter process of electrodeposition but also the structure and performance of the copper deposit obtained. In this paper, the developments of the study methods and the related theories for electrocrystallization are reviewed. The influence of pH, additives, foreign metal irons, substrates and the electrodeposition conditions on the electrocrystallization of copper are discussed in detail. The development trend in this field is also prospected.

关 键 词：铜 电结晶 成核机理 电沉积 

分 类 号：O614.12[理学—无机化学] O646.54[理学—化学]