低黏度慢固化环氧胶粘剂的研究  

Study on low viscosity and slow-curing epoxy resin adhesive

作　　者：胡高平[1] 高杰[1] 肖卫东[2] 

机构地区：[1]湖北大学化工厂,湖北武汉430062 [2]湖北大学材料科学与工程学院,湖北武汉430062

出　　处：《粘接》2008年第4期25-26,共2页Adhesion

摘　　要：在建筑加固胶行业中，胶的适用期一直是制约施工的关键因素，本文采用化学方法对芳香胺进行改性，制得低黏度固化剂，得到固化慢强度高的环氧胶，满足建筑加固行业在较高温度（35—40℃）下的施工要求。In the building reinforcing adhesive industry, the working life of adhesive has been the key factor to restrict construction. In this paper,the aromatic amine was modified by chemical method and the low viscosity curing agent and the slow-curing and high strength epoxy resin adhesive were obtained. This adhesive can meet the construction requirement at higher temperature（ 35 - 40 ℃ ）for building reinforcing .

关 键 词：适用期 芳香胺 建筑加固胶标准 

分 类 号：TQ433.437[化学工程]