单晶硅与单晶铜的微摩擦性能比较  

The Comparison between Single Crystal Silicon and Cuprum's Micro-tribological Properties

作　　者：李卓谡[1] 赵玉洁[2] 贾晓娜[1] 

机构地区：[1]中国矿业大学机电工程学院 [2]中国矿业大学材料工程学院,江苏徐州221116

出　　处：《机械管理开发》2008年第2期4-5,共2页Mechanical Management and Development

摘　　要：采用微划痕试验对单晶硅和单晶铜进行了材料的微摩擦学实验研究,在不同载荷的情况下研究了两种材料的摩擦系数变化,发现随着载荷的增大,试样与针尖的摩擦系数误差随之减小;单晶硅的摩擦系数随载荷的增大而减小,单晶铜的摩擦系数则随载荷的增大而增大,呈现相反特性。Micro-scale scratching is employed to study the micro-tribological properties between single crystal silicon and single crystal euprum, and comparative analysis are made about the micro friction coefficient between the two samples and diamond tip under different loads, results of the test show that according to the increaseing of the load, the error of the sample＇s friction coefficient is decreased,and the friction coefficient of crystal silicon is decreased,while single crystal cuprum is increased.

关 键 词：微划痕 单晶硅 微摩擦性能 对比 

分 类 号：TB302.3[一般工业技术—材料科学与工程]