电子封装中超声波线焊的瞬态热-结构有限元分析  

Transient Thermo-structural FEM Analysis of Ultrasonic Wire Bonding in Electronic Package

作　　者：丁勇[1] 郑荣跃[1] 王新堂[1] 

机构地区：[1]宁波大学,宁波315211

出　　处：《中国机械工程》2008年第7期807-811,共5页China Mechanical Engineering

基　　金：宁波市青年科学基金资助项目(2005A620009);浙江省自然科学基金资助项目(Y607563);浙江省教育厅科研计划资助项目(20070959)

摘　　要：用三维有限元方法对超声波线焊进行了瞬态的热-结构分析。为了用较小的规模模拟相对较长的金线和较大的焊盘,提出了一种温度场分析的等效方法。有限元模拟结果显示:超声波线焊中的总体温度远低于金属的熔点,说明总体温度的升高不是导致超声波线焊的直接原因;焊盘越小,总体温度越高,所以减小焊盘的尺寸能提高焊接性能;较大的压碶键合力对应的总体温度也较高,但是效果不明显,而且容易损伤金线。Thermal-structural analysis was performed for ultrasonic wire bonding （UWB） by three dimensional finite element method （FEM）. To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis. The FEM analyses show that the bulk temperature rise in UWB is far lower than the melting temperature of the wire and bond pad, and that indicates the bulk temperature is not the direct mechanism of UWB. Smaller bond pad leads higher bulk temperature, so that the wire bondability can be improved by reducing the pad size. Higher bond force means higher bulk temperature, but too high bond force will impair the gold wire.

关 键 词：超声波线焊 有限元方法 瞬态温度场 焊接可靠性 

分 类 号：TN305[电子电信—物理电子学]