新型硅胶-聚合胺树脂从氯化钴电解液中深度净化除铜  

DEEPLY MOVING COPPER FROM COBALT CHLORIDE ELECTROLYTE WITH NOVEL SILICA-POLYAMINE RESIN

作　　者：温俊杰[1] 张启修[1] 张贵清[1] 张力萍[1] 

机构地区：[1]中南大学冶金科学与工程学院,长沙410083

出　　处：《离子交换与吸附》2008年第2期162-167,共6页Ion Exchange and Adsorption

摘　　要：SP-C是一种新型硅胶-聚合胺复合材料树脂,对铜具有较好的选择吸附性能。本文研究了该树脂在模拟氯化钴电解液中深度净化除铜工艺。在Co2+～80g/L、Cu2+0.5g/L～2.0g/L、pH2～4、温度20℃～60℃的氯化钴电解液中,考察了该树脂对铜的吸附性能。结果表明,随料液pH增大以及温度升高,铜的交换容量增大;料液Cu2+浓度对交换容量影响较小;最佳吸附条件为:料液pH4、接触时间30min,温度60℃。对比研究了盐酸、硫酸两种解析液,硫酸显示出更好的解析效果,最佳解析条件为H2SO42mol/L、解析接触时间40min。最佳工艺条件下,每毫升湿树脂对铜的工作交换容量及饱和交换容量分别为0.439mol和0.508mol,铜的解析液峰值浓度为28g/L。SP-C is a novel silica-polyamine composite material chelating resin. The resin has good selective adsorption property for copper. This paper studies on the deeply removing copper process from the simulated cobalt chloride electrolyte with the resin. Adsorption performance of the resin for copper is researched, adsorption experimental condition are Co^2＋ -80g/L, Cu^2＋ 0.5g/L-2.0g/L, pH 2-4, temperature 20℃-60℃; The result shows that the higher the pH and temperature are, the higher the exchange capacity of the resin is; Cu^2＋ composition has no big influence on adsorption; the optimal adsorption condition is solution pH4, contact time 30min, temperature 60℃. Comparing sulfuric acid with hydrochloric acid, sulfuric acid has better desorption performance; the optimal desorption condition is H2SO4 2mol/L, contact time 40min. Under the optimal condition operational exchange capacity and saturate exchange capacity of per milliliter wet resin for copper are 0.439mmol and 0.508mmol respectively, after resin being desorbed, the peak of copper is 28g/L.

关 键 词：硅胶-聚合胺树脂 氯化钴电解液 离子交换 深度净化除铜 

分 类 号：TQ028.3[化学工程]