Zn^(2+)作为化学镀镍溶液稳定剂的研究  

Effect of Zn^(2+) as a Stabilizer on the Stability of Electroless Nickel Plating Bath

作　　者：陈智栋[1] 刘启发[1] 王文昌[1] 孔泳[1] 董如林[1] 光崎尚利 

机构地区：[1]江苏工业学院化学化工学院,江苏常州213164 [2]常州江工阔智电子技术有限公司,江苏常州213164

出　　处：《材料保护》2008年第4期33-35,共3页Materials Protection

摘　　要：为了保持化学镀镍液的稳定性,添加微量Zn2+作为化学镀Ni-P合金镀液的稳定剂,通过稳定性试验以及镀速和镀层形貌分析,评价了Zn2+的稳定作用,探讨了Zn2+的作用机理。研究表明,加入Zn2+可提高Ni-P合金化学镀液的稳定性,并使镀层形貌得到较大的改善。Trace Zn2+ was added to the plating bath for electroless Ni-P plating as a stabilizer so as to keep the stability of the plating bath.The effect of Zn2+ on the stability of the electroless Ni-P plating bath was investigated,while the deposition rate and morphology of the Ni-P coating were investigated.It was found that Zn2+ contributed to improve the stability of the electroless Ni-P plating bath and the appearance quality of the Ni-P coating.

关 键 词：化学镀 锌离子 稳定剂 NI-P合金 

分 类 号：TQ153.1[化学工程—电化学工业]