化学沉积Ni-Cu-P三元合金涂层的制备及其表征  

Preparation and Characterization of Electroless Ni-Cu-P Alloy Deposition

作　　者：鲁香粉[1] 吴玉程[1] 宋林云[1] 胡小晔[2] 郑玉春[1] 黄新民[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,合肥230009 [2]中国科学院固体物理研究所,合肥230031

出　　处：《金属功能材料》2008年第2期24-28,共5页Metallic Functional Materials

基　　金：国家自然科学基金(批准号:20571022);教育部博士点基金(批准号:20060359011);安徽省教育厅重点科研项目(2006KJ044A)

摘　　要：采用化学沉积的方法,在低碳钢表面上制备Ni-Cu-P三元合金镀层,研究了镀液组成和操作条件对镀层沉积速率和显微硬度的影响,确定了最佳工艺条件为:硫酸镍30g/L,次亚磷酸钠15g/L,硫酸铜3.5g/L,pH=9,95℃,负载因子0.48dm2/L,醋酸钠20g/L,柠檬酸三钠60g/L,沉积时间2h,采用X射线衍射仪(XRD)和扫描电子显微镜(SEM)对镀层进行表征。结果表明:所得的化学镀层为非晶态,经过400℃热处理后镀层晶化。镀层的沉积速率和显微硬度随硫酸铜浓度、次亚磷酸钠浓度及pH值的增加先增后减,随温度的升高而增加。Electroless deposition of Ni-Cu-P alloy on mild steel specimens was carried out. The effects of composition of bath and operating condition on the deposition rate and microhardness of Ni-Cu-P deposits were studied. The optimal process conditions were identified as follows： 30g/L NiSO4 · 6H2O, 15g/L Nail2 PO4 · H2O, 3.5g/L CuSO4 · 5H2O, pH=9, 95℃, loadfactor of 0.48dm^2/L, 20g/L CH3COONa, 60g/L C6HsOTNa3 · H2O,plating time 2h. The electroless Ni-Cu-P deposits were characterized by XRD and SEM. The results show that the electroless Ni-Cu-P deposits have amorphous structure. After heat treatment at 400℃, the electroless Ni-Cu-P deposits were crystallized. The deposition rate and microhardness first increased and then decreased with increasing the concentration of CuSO4 and NaH2PO4 and pH of bath, while increased with increasing temperature.

关 键 词：化学沉积 Ni—Cu—P 沉积速率 显微硬度 

分 类 号：TQ153.2[化学工程—电化学工业]