多层共烧元件界面研究的现状与展望  

Current Research Status and Prospect of Multilayer Cofired Components Interfaces

作　　者：杜支波[1] 包生祥[1] 彭晶[1] 李世岚[1] 马丽丽[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,成都610054

出　　处：《材料导报》2008年第4期26-29,共4页Materials Reports

基　　金：国防科工委共性项目资助

摘　　要：通过调研国内外多层陶瓷元件界面的研究现状,并结合自身工作,分析了在制备过程中多层陶瓷元件界面所存在的关键问题及其难点:共烧匹配性、扩散、结合性能等,提出了相应的控制措施,展望了其发展方向。并介绍了主导烧结曲线(MSC)、有限成分法(FEM)等相关的理论模型。这些都是有效控制界面品质,获得高性能多层陶瓷元件的关键。A review on the progress and research of current multilayer components interfaces is presented. The existing problems of the current interface are briefly introduced, including the interdiffusion, co-fire match and bond strength. Suggestions on how to control and resolve those problems are given. The future of the research on multilayer components interfaces is also prospected. The modeling and numerical simulation of material and device related properties are recommended ,such as the master sintering curve （MSC） and finite element method （FEM） and so on. All of these are the key points to achieve the good-performance multilayer components with high-quality interfaces.

关 键 词：多层元件 界面 共烧匹配 扩散 主导烧结曲线 

分 类 号：TS736[轻工技术与工程—制浆造纸工程] TQ174.7[化学工程—陶瓷工业]