光学玻璃微切削时材料去除机理和表面质量的研究  

Research on Material Removal Mechanism and Surface Quality in Micro-cutting of Optical Glasses

作　　者：修树东[1] 周明[2] 李敏[2] 

机构地区：[1]浙江林学院工程学院 [2]哈尔滨工业大学

出　　处：《工具技术》2008年第4期15-17,共3页Tool Engineering

基　　金：高等学校博士学科点专项科研基金项目(项目编号:20060213001);国家高技术研究发展专项(863计划)项目(项目编号:2006AA04Z314)

摘　　要：通过显微压痕和纳米压痕试验,研究了Soda-lime光学玻璃在微/纳米尺度下的材料去除机理,发现外加载荷的幅值对脆性材料变形方式有直接影响。对光学玻璃的金刚石普通切削和超声振动切削试验结果表明,超声振动切削的实际有效切削深度与名义切削深度有着较好的一致性,合理选择金刚石超声振动切削参数可实现光学玻璃的塑性域切削。The material removal mechanism in micro-cutting of soda-lime optical glass was analyzod by micro and nano indentations. The magnitudes of applied loads were found to exert a considerable influence on material deformation mode. Conventional and ultrasonic vibration assisted diamond cutting tests of soda-lime glass were performed. Real depths of cut in ultrasonic vibration cutting correspond well with the nominal ones. Ductile regime cutting of the optical glass can be realized by selecting process parameters properly.

关 键 词：金刚石切削  光学玻璃  超声振动切削  微/纳米压痕 

分 类 号：TG580.6[金属学及工艺—金属切削加工及机床] TQ171.734[化学工程—玻璃工业]