Cu-ZrW_2O_8复合镀层的制备  

Preparation of Cu-ZrW_2O_8 composite coatings by electric deposition

作　　者：谭澄宇[1] 郑学斌[1] 赵旭山[1] 刘宇[1] 李劲风[1] 

机构地区：[1]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《中南大学学报（自然科学版）》2008年第2期234-238,共5页Journal of Central South University:Science and Technology

基　　金：民口配套项目(MKPT-04-017)

摘　　要：以ZrO2和WO3为原料,通过两步烧结法制备具有负热膨胀性的钨酸锆(ZrW2O8)粉体,利用X射线衍射(XRD)对合成粉体进行分析。在含ZrW2O8粉体的酸性镀铜溶液中进行复合电镀,就电流密度、电镀时间以及添加剂对复合镀层中ZrW2O8粉体含量的影响进行分析,并利用扫描电镜(SEM)对不同条件下镀层表面的微观形貌进行观察与分析。实验结果表明:电流密度控制在2A/dm2时,镀层中能获得较高的粉体含量;随着电镀时间延长,粉体在镀层中含量呈峰值变化;镀液中添加十六烷基三甲基溴化氨(CTAB)或十二烷基硫酸钠(SDS)并不利于复合镀层中ZrW2O8粉体含量的提高。Negative thermal expansion material ZrW2O8 powders were synthesized using ZrO2 and WO3 as raw materials, ZrW2O8 powder feature was characterized by X-ray diffraction （XRD） analysis, Cu-ZrW2O8 composite coatings were prepared in acidic solution containing zirconium tungstate particles. The effects of electric current density, plating time and addition agent on the content of ZrW2O8 particles in the composite coating were studied. The morphologies of Cu-ZrW2O8 composite coatings under various plating conditions were characterized by SEM, The results show that there are more ZrW2O8 particles in the composite coating at the current density of 2 A/dm^2. In the content there may occur little peak change with plating time and it is debasement adding CTAB （cetyltrimethyl ammonium bromide） or SDS （lauryl sodium sulfate） in electrolyte solution.

关 键 词：Cu-ZrW2O8复合镀层 负热膨胀 电镀 粉体 

分 类 号：TG425.2[金属学及工艺—焊接]