O相合金Ti-22Al-25Nb固态扩散连接  

Solid diffusion bonding of Ti-22Al-25Nb O phase alloy

作　　者：邹贵生[1] 白海林[1] 谢二虎[1] 吴树甲[1] 吴爱萍[1] 王庆[1] 任家烈[1] 

机构地区：[1]清华大学机械工程系教育部先进成形制造重点实验室,北京100084

出　　处：《中国有色金属学报》2008年第4期577-582,共6页The Chinese Journal of Nonferrous Metals

基　　金：清华大学基础研究基金资助项目(Jcqn2005011)

摘　　要：用热-力学模拟试验机Gleeble 1500D进行O相合金Ti-22Al-25Nb的固态扩散连接。结果表明:当连接温度和连接压强分别不低于970℃和7 MPa以及保温时间不短于30 min时,能获得界面结合致密的接头;当连接温度高于1 000℃时,B2基体相明显粗化,且O相明显减少;当连接温度、压强和保温时间分别为1 020℃、7 MPa和30 min时,接头室温和650℃的拉伸强度分别为925 MPa和654 MPa;当连接温度不高于1 000℃的接头,拉伸断裂大部分发生在结合界面;当连接温度高于1 000℃时,则断裂主要发生在近界面母材中。The solid diffusion bonding of Ti-22Al-25Nb O phase alloy was performed with a thermal-mechanical simulator Gleeble 1500D, The results show that a tight bonding interface is formed under conditions of the bonding temperature higher than 970 ℃, bonding pressure higher than 7 MPa and holding time longer than 30 min. When the bonding temperature is higher than 1 000 ℃, the interfacial matrix phase B2 is coarsened and increased, while the amount of O phase is decreased. The tensile strengths at room temperature and 650 ℃ of the joints under conditions of bonding temperature 1 020 ℃, bonding pressure 7 MPa and bonding time 30 min reach up 925 and 654 MPa, respectively. The tensile fracture of joints mostly occurs at the bonding interfaces when the bonding temperature is lower than 1 000 ℃, while the tensile fracture of joints mostly occur in base materials near the bonding interfaces when the bonding temperature is higher than 1 000 ℃,

关 键 词：D相合金:扩散连接:界面结合 接头强度 

分 类 号：TG407[金属学及工艺—焊接]