W-Cu梯度热沉材料的致密性和力学性能  

Compact and Mechanical Properties of W-Cu Gradient Heat-Sink Materials

作　　者：刘彬彬[1] 鲁岩娜[1] 谢建新[1] 

机构地区：[1]北京科技大学新金属材料国家重点实验室,北京100083

出　　处：《稀有金属材料与工程》2008年第4期697-700,共4页Rare Metal Materials and Engineering

基　　金：国家杰出青年科学基金(50125415)

摘　　要：对采用粒度配比和热压固相烧结方法制备的W-Cu梯度热沉材料的致密性和力学性能进行了研究。结果表明:W-Cu梯度热沉材料各梯度层均达到近全致密的程度,封接层,中间层,散热层的相对密度分别为98.6%,99.1%和99.5%;漏气率的指标满足真空封装的使用要求;随着致密性的增加,封接层和中间层的硬度增加,在相同致密性的条件下,中间层的硬度略高于封接层的硬度;W-Cu梯度热沉材料的抗弯强度明显高于各梯度层的抗弯强度,达到505.8MPa;封接层、中间层和散热层的抗压强度分别为547.1、619.1和416.0MPa。Compact and mechanical properties of W-Cu gradient heat-sink materials fabricated by particle size distribution and hot press solid phase sintering are investigated. The results show that each gradient layer of W-Cu gradient heat-sink materials reaches nearly full density, and relative densities of sealing, transitional and radiating layers are 98.6%, 99.1% and 99.5%, respectively. The leakage rate meets the requirements of vacuum package. With the increase of relative density, the hardness of sealing layer and transitional layer is increasing. With the same relative density, the hardness of transitional layer is higher than that of sealing layer. The bending strength of W-Cu gradient heat-sink materials reches to 505.8 MPa, being higher than that of each gradient layer. The compress strength of sealing, transitional and radiating layers are 547.1, 619.1 and 416.0 MPa, respectively.

关 键 词：W—Cu复合材料 梯度功能材料 相对密度 粒度配比 热压烧结 

分 类 号：TB331[一般工业技术—材料科学与工程]