S-BPDA／ODA型聚酰亚胺的合成及聚集态结构对薄膜性能的影响  

Synthesis of S-BPDA/ODA Polyimide and the Effect of Aggregation Structure on its Film Properties

作　　者：刘贤文[1] 李曹[1] 庞忠群[1] 顾宜[1] 

机构地区：[1]高分子材料工程国家重点实验室,四川大学高分子科学与工程学院,成都610065

出　　处：《绝缘材料》2008年第2期6-9,共4页Insulating Materials

基　　金：国家自然科学基金(50103007);四川省杰出青年基金(04ZQ026-037)

摘　　要：采用两步法和一步法涂膜热酰亚胺化工艺分别制备了S-BPDA/ODA的聚酰亚胺(PI)薄膜。偏光观察发现,一步法制备的薄膜经过250℃以上的温度处理后出现明显的微晶结构,在相同的酰亚胺工艺条件下两步法制备的薄膜没有出现微晶结构。DMA测试表明,一步法与两步法制备的薄膜Tg分别为294℃和276℃;相比两步法,一步法制备的薄膜具有更佳的力学和热稳定性能。分析认为,微晶结构的交联作用和高酰亚胺化程度使一步法制备的薄膜具有更佳的性能。Polyimide films derived from 3, 3＂, 4, 4＂-biphenyltetracarboxylic dianhydride （s-BPDA） and ODA were prepared by two-step and one-pot polymerization under the same imidization procedures. POM shows that micro-crystal exists in the films from one-pot polymerization after treated above 250℃while the same phenomenon was not found in films from two-step polymerization. DMA analysis shows that the Tg of the one-pot film is 294℃,while two-step film is 276℃, Micro-crystal structure, which plays the role of cross-linkage, together with the higher degree of imidization improves the thermal stability and mechanical property.

关 键 词：3 3’ 4 4’-联苯四甲酸二酐 聚酰亚胺 薄膜 聚集态结构 性能 

分 类 号：TM215.3[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]