镧-镱改性化学镀制备陶瓷负载型钯膜的动力学研究  

Study on Kinetics of Palladium Inorganic Composite Membrane Prepared by Yb-La Modified Elecreoless Plating

作　　者：蒋柏泉[1] 刘贤相[1] 吴琴芬[1] 王敏炜[1] 叶志强[1] 

机构地区：[1]南昌大学环境与化学工程学院,江西南昌330031

出　　处：《南昌大学学报（工科版）》2008年第1期12-15,共4页Journal of Nanchang University(Engineering & Technology)

摘　　要：考察了镧-镱改性化学镀钯各主要工艺参数氯化钯、水合肼、乙二胺四乙酸二钠盐、镱-镧混合浓度和镀覆温度对钯沉积速度的影响。在此基础上,建立了钯沉积速度的动力学方程。经实验验证,该数学模型与实验结果吻合度较好,对镧-镱改性化学镀钯沉积过程的调节和产物的控制具有一定的参考价值。Single factor method was used to investigate the effects of the main technical parameters in electroless Pd plating process, such as the concentations of palladium chloride, hydrazine hydrate, complexon（e） Ⅱ , ytterbium - lanthanum and plating temperatureon,on the Pd deposition rate,based on which, the kinetic equation of palladium deposition was established. The experiment proved that the mathematical model was in a good accordance with the practical results, which has certain reference value for the process adjusting and product controling of the palladium deposition.

关 键 词：钯 化学镀 动力学 镀速 

分 类 号：O643.3[理学—物理化学] TQ153.3[理学—化学]