铝材化学镀镍-铜-磷合金  

Electroless Ni-Cu-P Alloy Plating of Aluminium

作　　者：夏承钰[1] 

机构地区：[1]西安理工大学,710048

出　　处：《材料保护》1997年第11期15-18,共4页Materials Protection

摘　　要：研究了铝在以次亚磷酸钠为还原剂、柠檬酸钠为络合剂的碱性槽液内化学镀Ni-Cu-P的工艺。分析了影响镀层成分、共沉积过程及镀层与基体结合强度的因素。本文指出,镀液[Ni^(2+)]/[Cu^(2+)]在1.2～20.0范围变化时,可获得含铜(95～51)％(wt)的Ni-Cu-P合金镀层。The electroless Ni-Cu-P alloy plating of aluminium in alkali bath solution using NaH2PO2 as reductant and sodium citrate as complex agent was investigated. The experimental results showed that as the value of [Ni2+]/[Cu2+] in the bath varied from 1. 2 to 20, 95% to 51%(wt. ) copper in Ni-Cu-P alloy deposit were obtained.

关 键 词：铝 化学镀 强度 电镀 镀合金 

分 类 号：TQ153.2[化学工程—电化学工业]