铝电解槽中黏土质砖的抗渗性研究  

Anti-penetration of Chamotte Brick for Aluminum Reduction Cell

作　　者：刘世英[1] 石忠宁[1] 任必军[1] 邱竹贤[1] 

机构地区：[1]东北大学材料与冶金学院,沈阳110004

出　　处：《有色金属》2008年第2期65-67,106,共4页Nonferrous Metals

基　　金：国家自然科学基金资助项目(50334030)

摘　　要：通过浸泡法和坩埚法对铝电解槽用黏土质砖进行抗渗性研究,利用X射线衍射法对工业上已经使用过的黏土质砖进行分析。结果表明,黏土质耐火砖在高分子比的电解质中浸泡2h后,质量损失率是47.25%,而黏土质保温砖经90min的浸泡后完全溶解在电解质里。坩埚法试验中,耐火砖要比保温砖的抗渗性能好,但两种砖都不耐电解质渗透。工业电解槽中,渗透到黏土质砖的电解质中含有大量的NaF,黏土质砖中的莫来石变成了霞石。The anti-penetration of chamotte brick applied to aluminum reduction ceils is investigated by soak method and crucible method. The chamotte brick used in industrial ceils are characterized by XRD in order for phase analysis. The results show that the mass loss rate of refractory brick is 47.25% in high crylite ratio （CR） electrolyte molten salt for 2h. And the insulating brick is completely dissolved by electrolyte molten salt for 90min. The anti-penetration of refractory brick is better than that of insulating brick. However, their antipenetration is bad for electrolyte. In industrial ceils, chamotte brick contained a lot of NaF and its composition of porzite turned into nepheline.

关 键 词：冶金技术 铝电解槽 抗渗性 黏土质砖 电解质 

分 类 号：TF821[冶金工程—有色金属冶金] TF065.1