JOINING MECHANISMS OF β"-Al_2O_3 CERAMIC AND PYREX GLASS TO Al MATRIX COMPOSITE  

作　　者：LIU Cuirong MENG Qingsen LU Xiaoying HU Lifang 

机构地区：[1]College of Material Science and Engineering,Taiyuan University of Technology, Taiyuan 030024, China [2]College of Material Science and Engineering,Taiyuan University of Science and Technology, Taiyuan 030024, China

出　　处：《Chinese Journal of Mechanical Engineering》2008年第2期42-44,共3页中国机械工程学报（英文版）

基　　金：National Natural Science Foundation of China (No.50375105,No. 50671070)

摘　　要：The bonding of β″-Al2O3 and pyrex glass to A1 matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope （SEM）, energy dispersive X-ray fluorescence spectrometer （EDX）. It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.The bonding of β″-Al2O3 and pyrex glass to A1 matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope （SEM）, energy dispersive X-ray fluorescence spectrometer （EDX）. It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.

关 键 词：β″-Al2O3 Pyrex glass Al matrix composite Anodic bonding 

分 类 号：TH145[一般工业技术—材料科学与工程]