电沉积Cu/Ni多层膜硬度与调制波长关系的研究  

Research on Relationship Between Hardness and Modulated Wavelength of Cu/Ni Multilayers by Electrodepositing

作　　者：李武会[1] 任凤章[1] 苏娟华[1] 马战红[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003

出　　处：《河南科技大学学报（自然科学版）》2008年第3期1-4,共4页Journal of Henan University of Science And Technology:Natural Science

基　　金：国家自然科学基金项目(50771042);河南省高等学校青年骨干教师资助计划项目(2005-461);河南省自然科学基金项目(0411050100)

摘　　要：分别采用双槽法和单槽法制备了不同调制波长的Cu/Ni多层膜,研究了多层膜硬度与调制波长之间的关系。结果表明,当调制波长大于33nm时,硬度与调制波长的关系符合Hall-Petch关系式;小于33nm时,偏离了Hall-Petch关系式;等于21nm时,硬度出现了峰值,约为HV451.8。In this paper different modulated wavelength of Cu/Ni multilayers was prepared by using double-bath and single-bath methods respectively.The relationship between the hardness and the modulated wavelength was studied.The results showed that when the modulated wavelength was more than 33 nm,the Hall-Petch relationship can be applied.However,with grain sizes less than 33 nm,a clear deviation from the regular Hall-Petch relationship was observed resulting in a plateau in the hardness curve at about HV451.8 for grain size of 21 nm.

关 键 词：电沉积 多层膜 硬度 调制波长 

分 类 号：TG115.5[金属学及工艺—物理冶金] O484.5[金属学及工艺—金属学]