含—NH_2基团的有机改良硅酸盐材料合成及IR,DTA和TG分析  

FABRICATION OF ORMOSILS CONTAINING AMINOGROUP AND IR,DTA AND TG ANALYSIS

作　　者：夏海平[1] 朱从善[1] 干福熹[1] 

机构地区：[1]中国科学院上海光学精密机械研究所

出　　处：《硅酸盐学报》1997年第5期554-560,共7页Journal of The Chinese Ceramic Society

摘　　要：以正硅酸乙酯［Ｓｉ（ＯＣ２Ｈ５）４］，γ缩水甘油醚基丙基三甲基硅烷［ＣＨ２ＯＣＨＣＨ２Ｏ（ＣＨ２）３Ｓｉ（ＯＣＨ３）３，简称ＫＨ５６０］，胺基三甲基三乙氧基硅烷［ＮＨ２（ＣＨ２）３Ｓｉ（ＯＣ２Ｈ５）３，简称ＫＨ５５０］，二乙烯三胺基甲基三乙氧基硅烷［ＮＨ２ＣＨ２ＣＨ２ＮＨＣＨ２ＣＨ２ＮＨＣＨ２Ｓｉ（ＯＣ２Ｈ５）３，简称ＮＤ２３０］为原料，用溶胶凝胶（ｓｏｌｇｅｌ）工艺，把胺基引入材料基质中，制备了一些有机改良材料，用红外光谱、差热分析和热失重分析方法研究了材料的结构和性能。在５０℃烘箱中经较长时间处理得到的块体材料能用手工抛光而不破裂，表现了较好的弹性和稳定性。经２００℃热处理的复合材料，在红外光谱中明显显示存在着胺基结构。ＴＧ分析表明复合材料大约在３００℃以后由于有机物的挥发和分解而大量失重。Ormosils containing aminogroup(NH 2—) were synthesised with divinnylmelthytrie thoxysilane (ND230),3aminopropyltrietroxysilane(KH550),3glycidoxypropltrimethoxysilane(KH560),and tatraethyl silicate(TEOS).The structure and characteristics of ormosils were studied with IR,DTA and TG.The materials through heattreatment at 50℃ possess better flexibility and mechanical strength,and can be polished manually.After heattreatment at 200℃,the peak of aminogroup can be seen clearly in IR spectra.Ormosils thus obtained lose weight greatly after heattreatment above 300℃ due to volatilization and decomposition of organic part of ormosils.

关 键 词：溶胶凝胶 胺基 硅酸盐 差热分析 热失重分析 

分 类 号：TQ170.1[化学工程—硅酸盐工业] O657.99[理学—分析化学]