EP/APC/BMI共聚高性能树脂体系的研究与应用  

Preparation and application of EP/APC/BMI high-performance resin systems prepared by copolymerization

作　　者：刘润山[1] 刘景民[1] 刘生鹏[1] 张雪平[1] 

机构地区：[1]湖北省化学研究院,湖北武汉430074

出　　处：《粘接》2008年第5期29-34,共6页Adhesion

基　　金：湖北省自然科学基金资助项目(2007ABA158)

摘　　要：介绍和评述了环氧化合物(EP)/烯丙基苯基化合物(APC)/双马来酰亚胺(BM I)共聚高性能树脂体系及其化学与固化反应,综述了其在耐热电绝缘材料、覆铜板用高性能树脂、半导体封装料,先进复合材料树脂基体和耐热胶粘剂等领域的研究与应用进展情况。The EP/APC/BMI （ epoxide/allylphenyl/eompound/bismaleimide ） high-performance resin systems prepared by muhieomponent eopolymerization and their preparation and application were reviewed in this paper. And the progress of research and application for the EP/APC/BMI eopolymer resin in some fields, such as heat-resistant insulating materials, copper clad laminates, semiconductor encapsulating compounds, advanced composite resin matrix and heat-resistant adhesives etc. , were presented.

关 键 词：环氧化合物 烯丙基苯基化合物 双马来酰亚胺 高性能共聚树脂 

分 类 号：TQ322.41[化学工程—合成树脂塑料工业]