氰酸酯基耐高温低介电载体胶膜的制备与性能  

Preparation and Properties of High Temperature Resistant and Low Dielectric Loss Cyanate Ester Resin Based Structural Adhesive Film

作　　者：王冠[1] 付刚[1] 吴健伟[1] 匡弘[1] 付春明[1] 

机构地区：[1]黑龙江省石油化学研究院,哈尔滨150040

出　　处：《宇航材料工艺》2008年第2期12-16,共5页Aerospace Materials & Technology

摘　　要：为了满足现代高性能雷达天线罩结构粘接的要求,本文研制了氰酸酯基耐高温、低介电载体结构胶膜。以烯丙基化酚醛/双马树脂改性,在保持该胶膜耐高温性能的同时,改善了室温力学性能。通过加入贮存稳定剂解决了胶膜常温贮存期差的问题。胶膜在380℃下的剪切强度大于5 MPa。测试频率为9 375 MHz时,胶膜在380℃下的介电常数变化率小于5%。实验结果表明,该胶膜可用于耐高温透波材料的结构粘接。High temperature resistant and low dielectric loss cyanate ester （CE） resin based supported structural adhesive film for bonding advanced radar radomes was developed. The CE resin was modified by using an allylated novolac/bismaleimide resin to improve the room temperature mechanical properties of the film, while retaining its elevated temperature properties. Ambient shelf life of the film was improved by introducing a stabilizer into the base resin. Mechanical properties and dielectric properties of the film were studied. Lap shear strength of the film at 380℃ is over 5 MPa. Dielectric constant change rate of the film at 380℃ under the frequency of 9 375 MHz is less than 5%. Experimental results indicate that the film can be applied for structural bonding of high temperature transparent materials.

关 键 词：雷达天线罩 氰酸酯 稳定剂 贮存期 耐高温 介电性能 

分 类 号：TQ637[化学工程—精细化工] O482.4[理学—固体物理]