八氨基苯基笼形倍半硅氧烷改性的双马来酰亚胺树脂  

Bismaleimide Resins Modified by Octa(Aminophenyl) Silsesquioxane

作　　者：黄福伟[1] 周燕[1] 沈学宁[1] 黄发荣[1] 杜磊[1] 

机构地区：[1]华东理工大学国防材料工程研究所,上海200237

出　　处：《宇航材料工艺》2008年第2期17-20,33,共5页Aerospace Materials & Technology

基　　金：国家安全重大基础研究计划资助(5131802)

摘　　要：从苯基三氯硅烷出发,通过水解缩合合成八苯基笼形倍半硅氧烷(OPS),经发烟硝酸硝化得到八硝基苯基笼形倍半硅氧烷(ONPS),再经Pd/C催化还原得到八氨基苯基笼形倍半硅氧烷(OAPS),用红外光谱(IR)和核磁共振(NMR)表征了它们的结构。以溶液聚合制备了OAPS/BMI树脂,研究了OAPS含量对OAPS/BMI固化树脂热性能的影响,并考察了OAPS/BMI固化树脂的介电性能。研究结果显示:随着OAPS含量的上升,OAPS/BMI固化树脂的Tg变化不大,5%失重温度(Td5)下降。含5%质量分数OAPS的OAPS/BMI固化树脂的Tg达到429℃;Td5达到475℃,800℃残重率为51.9%;在7.95 MHz下其介电常数为2.92,tanδ为9.69×10-3。Octa （aminophenyl）silsesquioxane （OAPS） was prepared by nitration of octaphenylsilsesquioxane （OPS） in fuming nitric acid to form octa （nitrophenyl）silsesquioxane （ONPS）and by mild reduction of ONPS with Pd/C as a catalyst. OPS, ONPS and OAPS were characterized by FT - IR, 1H NMR, and 29Si NMR. The OAPS/ BMI resin was prepared by solution polymerization of OAPS and BMI. The curing behavior of OAPS/BMI resin was investigated by DSC and the thermal and dielectric properties of cured OAPS/BMI resin were studied. The DMA and TGA results indicated that the glass transition temperature （ Tg ） of cured OAPS/DPBPA/BMI resin changed unremarkably with the increas of OAPS content, while thermal decomposition temperature （ Td^5 ） decreased. The Tg of cured resin with 5% OAPS is 429℃, Td^5 is 475℃, and char yield 51.9% （800℃）, dielectric constant 2.92 and tanδ 9.69 × 10^ -3

关 键 词：八氨基苯基笼形倍半硅氧烷 改性双马来酰亚胺树脂 耐热树脂 热性能 介电性能 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业] O641.4[理学—物理化学]