晶体管水冷散热器的热分析及仿真研究  

Thermal Analysis and Simulation for Hydro-cooling-radiator of Transistors

作　　者：葛隽[1] 何闻[1] 

机构地区：[1]浙江大学机械与能源工程学院,杭州310027

出　　处：《机床与液压》2008年第5期161-164,150,共5页Machine Tool & Hydraulics

基　　金：国家自然科学基金资助项目(编号50675200);教育部留学回国人员科研启动基金资助项目(教外司留(2007)24号);浙江省留学回国人员科研启动基金资助项目(J20060043)

摘　　要：针对大功率晶体管的散热问题,对两种方案的水冷散热器设计进行了热分析和ANSYS仿真分析。首先,通过热力学和流体力学分析得到了散热器传热过程中ANSYS参数的计算方法;然后对水冷散热器的物理模型进行了分析,并对两种散热器进行仿真研究;结果表明:在并联管路散热器设计中适当添加中间管路并选择适当的直径和提高入口流量有利于提高散热效果。Due to the problem of radiating on high power transistors, thermal analysis and simulation of the hydro-cooling-radiator of high power transistors based on ANSYS was introduced. The radiating and hydromeehanies theory were presented generally, the radiating model of high power transistors with a hydro-cooling-radiator was built, and two kinds of hydro-cooling-radiators were analyzed and emulated. The results indicate that adding extra tube with optimum diameter and increasing flow on inlet could improve the effect of radiating.

关 键 词：水冷 大功率晶体管 散热 ANSYS 

分 类 号：TN305.94[电子电信—物理电子学]