微流体温度控制器的数值模拟与特性分析  

Numerical simulation and working behavior analysis of microfluidic temperature controller

作　　者：晁侃[1] 吴健康[1] 龚磊[1] 

机构地区：[1]华中科技大学武汉光电国家实验室,湖北武汉430074

出　　处：《传感器与微系统》2008年第5期58-60,63,共4页Transducer and Microsystem Technologies

基　　金：国家自然科学基金资助项目(10472036)

摘　　要：为了满足微电子封装过程对器件温度变化的精确控制,提出一种快速升降温的微型流体温度控制器,并采用流体力学软件FLUENT对温度控制器的液体—固体—空气一体化的流动—热传导过程进行数值模拟。在给定进口液体温度变化特征的情况下,通过数值分析考察控制器表面温度对进口液体温度变化的响应特性,包括时间跟随性(传热灵敏度)和温度变化振幅的衰减率(传热效率)。考察了控制器结构尺度、进口液体速度、温度变化波形、周期等参数对温度控制器的特性影响。结果表明:控制器厚度增加,控制器表面温度变化幅值衰减增大;控制器进口流速大,控制器表面温度变化幅值衰减率小;进口液体温度变化周期短,传感器表面温度变化幅值衰减增大;进口温度变化方形波的传热效率大于三角波形;传感器表面温度变化周期与进口温度周期相同,但存在相位差。A microfluidic temperature controller for accurate controlling temperature variation of electronic element in encapsulation process is presented. CFD software FLUENT is used to perform numerical simulation of liquid-solid-air integrative flow-heat transfer of the controller. Given inlet temperature variation condition, the temperature response behavior of the controller surface is investigated. The heat transfer efficiency, the ratio of temperature variation amplitude of solid working surface and inlet liquid are presented. The parameter effect including controller thickness, inlet liquid temperature, velocity, temperature variation shape and period on controller behavior is also studied. Numerical results indicate that the heat transfer efficiency increases as the controller thickness decreases, the inlet flow velocity increases, and period of temperature variation increases. It is also found that the heat transfer efficiency with square-shape temperature variation is higher than that with triangleshape variation, and the temperature variation period of controller working surface is the same as the inlet liquid, but has a slight phase difference.

关 键 词：微流体温度控制器 传热效率 数值模拟 

分 类 号：TK124[动力工程及工程热物理—工程热物理]