加辅助阴极钛板的离子渗氮工艺参数对TC4合金渗层厚度的影响  

INFLUENCE OF PLASMA NITRIDING TECHNICS PARAMETER ON THE SUBSTRATE OF TC4 MODIFIED LAYER THICKNESS

作　　者：詹科[1] 曲均志[1] 陈志勇[1] 秦林[1] 唐宾[1] 

机构地区：[1]太原理工大学表面工程研究所,太原030024

出　　处：《理化检验（物理分册）》2008年第5期219-222,共4页Physical Testing and Chemical Analysis(Part A:Physical Testing)

基　　金：国家自然科学基金资助项目(50501016);山西省自然科学基金资助项目(2006021023)

摘　　要：在辉光离子气体技术的基础上加上辅助阴极钛板,对TC4合金基材进行渗氮处理。通过选择典型的基体温度、保温时间和气体介质,设计了一组正交试验,并以渗层厚度为依据分析了渗氮工艺中基体温度、保温时间和气体介质对渗层厚度的影响。同时采用Axiovert25CA(Zeiss)光学图像分析仪和GDA750辉光光谱分析仪观察了优化工艺条件下改性层的显微组织及元素分布。结果表明,在辉光离子渗氮工艺中基体温度对TC4合金渗层厚度影响最大,在最优工艺条件下渗氮改性层的形成能显著提高基材表面硬度。A plasma nitriding process with a pure Ti cathode aided was employed on the substrate of TCA. The influence of parameters such as substrate temperature, gas medium and incubation time to the properties of plasma nitriding was studied. Microstructure and composition of the modified layer was analyzed using Zxiovert 25CA （Zeiss） and spectro GDA750 Discharge optical emission spectrometer. Result shows that during plasma nitriding process the substrate temperature is the more important than other parameters, and the modified layer can effectively improve the micro-hardness of the substrate.

关 键 词：辅助阴极 正交试验 离子渗氮 工艺优化 显微硬度 

分 类 号：TG156.82[金属学及工艺—热处理]