一种高可靠性SMD型片式NTCR的工艺设计  

Design for process of a high reliability SMD type chip NTCR

作　　者：袁国安 

机构地区：[1]广东风华高新科技股份有限公司,广东肇庆526020

出　　处：《电子元件与材料》2008年第5期68-70,共3页Electronic Components And Materials

基　　金：国家计委资助项目(计高技[2002]2207号)

摘　　要：为进一步提高SMD型片式NTCR性能的可靠性和增加其对机械应力的抵抗力,采用高聚物代替玻璃釉进行瓷体的外包封和柔性材料处理元件端头,对片式NTCR的结构和工艺路线作了改良设计。对所制0603规格元件进行了可靠性试验。结果显示:产品的稳态湿热和耐湿性能提高了25%,引出端镀层连接强度提高了100%。In order to eliminate mechanical cracking and get higher reliable SMD type chip NTCR, polymer coating process and flexible termination treatment were used in chip NTCR. The process way of chip NTCR was improved and its structure was changed. The reliability tests of 0603 type products were carried out. The results reveal that the moisture heat in steady state and resistance moisture performance for products can be increased by 25%, respectively. The connecting strength of exit termination coating increases by 100%.

关 键 词：电子技术 高可靠性 片式NTCR 高聚物包封 柔性端头处理 

分 类 号：TN37[电子电信—物理电子学]