多弧离子镀TiN/Cu纳米复合多层膜致硬机理的探讨  

Research on Super-hardness Mechanism of TiN/Cu Nano-composite Multilayer Films Prepared by Multi-arc Ion Plating

作　　者：穆静静[1] 王从曾[1] 马捷[1] 郑国龙[1] 

机构地区：[1]北京工业大学材料学院,北京100022

出　　处：《热加工工艺》2008年第8期15-17,21,共4页Hot Working Technology

基　　金：国家自然科学基金资助项目(50374003);北京市自然科学基金资助项目(2032003)

摘　　要：采用多弧离子镀技术制备单一的TiN薄膜和TiN/Cu纳米复合多层膜,研究了复合膜的硬度变化及相组成,初步探讨了TiN/Cu纳米复合多层膜的致硬机理。实验结果表明,Cu元素的掺入阻碍了TiN的生长,使复合膜硬度有了显著提高,制得硬度高达51GPa的TiN/Cu复合多层膜,其TiN以(111)和(200)两个晶面择优生长,且衍射峰强度极为接近,(200)面略高于(111)面。TiN single layer film and TiN/Cu nano-composite multilayer film were prepared by multi-arc ion plating, the change of hardness, the component of phase and crystal tropism of the two films were studied, and the super-hardness mechanism of TiN/Cu nano-composite multilayer film was primarily discussed. The results show that the growth of TiN is baffled by Cu intermingling, which consequently enhances the hardness of composite multilayer films. The film of TiN grows with two preference crystal sides of （111） ＆ （200） in TiN/Cu nano-composite films with the hardness of 51GPa, and the intensity of diffraction peaks is fearfully close, but side （200） is higher a little than side （111）.

关 键 词：多弧离子镀 TiN/Cu纳米复合膜 纳米晶 超高硬度 

分 类 号：TG174.444[金属学及工艺—金属表面处理]