钯-铂双层覆膜聚酰亚胺的CECVD制备与表征  

Preparation and Characterization of Palladium-Platinum Bilayer Films on Polyimide by Catalyst-Enhanced CVD

作　　者：郑建华[1] 冯文芳[2] 周锦兰[2] 田熙科[1] 俞开潮[2] 

机构地区：[1]中国地质大学,湖北武汉430074 [2]华中科技大学,湖北武汉430074

出　　处：《稀有金属材料与工程》2008年第5期918-921,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(40172018,20675033)

摘　　要：以N2、O2作载气,采用催化增强化学气相沉积（CECVD）法,于250～300℃和减压/常压下制得沉积于聚酰亚胺（PI）上的Pt,Pd/Pt和Pt/Pd金属双层薄膜。当使用Pd（hfac）2和Pt（COD）Me2为前驱体,在同一反应器内共沉积时只有Pt被沉积（钯配合物起催化剂作用）,金属铂、钯顺序沉积可形成双层膜。经XPS和SEM分析了所得沉积膜的表面结构与相组成。结果表明：所有沉积层与PI衬底的粘附性能良好;沉积速率为70～80nm/h,钯、铂粒径分别为100nm和100～150nm。Pd/Pt and Pt/Pd bilayer films on polyimide are prepared by catalyst-enhanced chemical vapor deposition （CECVD） in the carrier gases of N2, O2 at 250～300 ℃under a reduced pressure and a normal pressure. With the enhancement of palladium complex, the platinum is deposited by mixing the precursor platinum complex Pt（COD）Me2 and palladium complex catalyst Pd（hfac）2 in the same chamber. Sequential deposition of Pd and Pt metals are used for deposition of Pd/Pt and Pt/Pd bilayer films. These metal films are characterized by XPS and SEM, showing good adhesive properties with polyimide substrates. The deposition rate is 70～80 nm/h, and the particle sizes of Pd and Pt are in region of 100 nm and 100～150 nm, respectively. The CECVD mechanism of platinum is presumed.

关 键 词：聚酰亚胺 催化增强化学气相沉积 铂薄膜 钯-铂双层膜 表征 

分 类 号：O484[理学—固体物理]