无铅化学镀镍稳定剂研究  

Study on Lead-free Stabilizer for Electroless Nickel Plating

作　　者：董坤[1] 李德良[1] 吴赣红[1] 

机构地区：[1]湖南中南林业科技大学研究生部,湖南长沙410004

出　　处：《表面技术》2008年第3期12-13,29,共3页Surface Technology

摘　　要：为了研究出一种优良的无铅化学镀镍稳定剂,以传统的化学镀镍基础配方为前提,选择Na2S2O3、S1(一种含硫有机物)、CuSO4和苯并三氮唑作为稳定剂,比较了其对镀液的稳定性能、镀速和镀层性能等影响。结果表明:S1作为化学镀镍液的稳定剂,不仅能使镀液稳定性能良好,而且镀层性能优异。In order to study the lead-free stabilizer for electroless nickel plating, CuSO4 and benzotriazole were added respectively, and the stabilizing effects of these four bath were investigated. It is found that S1 is an excellent electroless nickel bath stabilizer bath very well but also bring an excellent corrosion resistance. four stabilizers of Na2S2O3 , S1, stabilizers on electroless nickel which can not only stabilize the

关 键 词：化学镀镍 无铅化 稳定剂 沉积速度 

分 类 号：TQ153.1[化学工程—电化学工业]